0201 chip capacitor footprint

Surface Mount Multilayer Ceramic Chip Capacitors for Commodity Applications RECOMMENDED SOLDERING CONDITIONS Lead (Pb)free terminated MLCCs are not only used on SMT with lead (Pb)free solder paste, but also suitable to be used with leadcontaining solder paste. Abstract: dimensions of footprint Table 9 Reflow soldering; for footprint dimensions see Fig. 11 SIZE 0201 0402 0603, L1 L3 MBB211 0805 0805 Fig. 2 Surface mounted Size Chart Footprint Selection chart TopLine Dummy Component Foot Print Cross Reference.

methodology of IPC 782A for ceramic, tantalum and aluminum capacitors. To extend the methodology, and detail land dimensions for ceramic, tantalum and aluminum capacitor sizes not included in IPC 782A.

To detail land patterns for capacitor arrays. To note some errors in IPC 782 and provide corrections. Legal Disclaimer Notice www. vishay. com Vishay Revision: 08Feb17 1 Document Number: Disclaimer ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE L W t Ceramic Caps, SMD AVX 947 AVX 0201, 0402, 0603 Multilayer Ceramic Chip Capacitors Application Note: A higher voltage capacitor may be used in a lower voltage Rev: 0 PCB Footprint Library Tantalum Capacitors EIA Standard Low Inductance MLCs Chip Film Capacitors SuperCaps Filters TVS Diodes Generally, the land width should be 0.

7 to 0. 8 times (W) of the width of chip resistor. In case of re ow soldering, solder amount can be adjusted, therefore the land width should be set to 1. 0 to 1. 3 times chip resistor width (W). Recommended Soldering Conditions Recommendations and precautions are described below.



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